Electrical apparatuses, and methods of forming electrical apparatuses

ABSTRACT

The invention encompasses an electrical apparatus. Such apparatus comprises a first substrate having first circuitry thereon. The first circuitry has a terminal extending therefrom, and the terminal defines a first electrical node. The apparatus further comprises a first dielectric material covering a predominate portion of the first circuitry and not covering the first electrical node. Additionally, the apparatus comprises a second substrate having second circuitry thereon. The second circuitry has a terminal extending therefrom, and such terminal defines a second electrical node. A second dielectric material covers a predominate portion of the second circuitry, but does not cover the second electrical node. The second substrate comprises a different material than the first substrate. A portion of the second substrate is over a portion of the first substrate to define an overlap between the first and second substrates. The second electrical node overlaps the first electrical node in the overlap between the first and second substrates. A conductive material is within the overlap between the first and second substrates and electrically bonds the first and second electrical nodes to one another. The invention also encompasses termite sensing devices, methods of forming electrical apparatuses, and methods of sensing termites.

RELATED PATENT DATA

This patent resulted from a divisional application of U.S. patentapplication Ser. No. 09/384,836, which was filed on Aug. 27, 1999.

TECHNICAL FIELD

The invention pertains to electrical apparatuses, termite sensingapparatuses, and methods of forming electrical apparatuses.

BACKGROUND OF THE INVENTION

A prior art apparatus and method for detecting termite infestation isdescribed with reference to FIGS. 1 and 2. Specifically, a termitedetection device 10 is shown in an assembled configuration and insertedwithin the ground 12 in FIG. 1, and is shown in a disassembledconfiguration in FIG. 2. Device 10 comprises an outer receptacle 14having a plurality of orifices 16 (only some of which are labeled)extending therethrough. A cap (or a lid) 18 is provided to cover the topof receptacle 14. Preferably, receptacle 14 is inserted into the groundto a depth at which cap 18 will rest approximately at a surface of theground.

A pair of wooden blocks 20 and 22 are provided within receptacle 14, andconstitute “bait” for termites proximate to device 10. A holder 24 isprovided between blocks of wood 20 and 22 and comprises a shelf 26 uponwhich blocks 20 and 22 rest. Holder 24 and blocks 20 and 22 togethercomprise an assembly 27 which can be removably inserted into receptacle14.

Holder 24 comprises a portion 28 which protrudes upwardly beyond blocks20 and 22 in the assembled configuration of FIG. 1. Portion 28 comprisesan eye 30 (shown in FIG. 2) which can simplify removal of assembly 27from receptacle 14 using a tool with a hook.

In operation, receptacle 14 is inserted into ground 12, and blocks 20and 22 are subsequently left in receptacle 14 for a period of time.Blocks 20 and 22 function as a sensing apparatus to determine if atermite infestation is present in an area proximate device 10.Specifically, if termites are present, such will penetrate throughorifice 16 to reach wooden blocks 20 and 22. The termites will thenburrow into the wooden blocks 20 and 22.

At regular intervals, cap 18 is removed and blocks 20 and 22 withdrawnfrom device 14. Blocks 20 and 22 are then surveyed for termite-inflicteddamage, and possibly a presence of termites themselves.

Generally, a number of apparatuses 10 will be spread around a givenlocation, such as, for example, a house or other wooden structure. Eachof the apparatuses will be checked at a regular interval to determine ifa termite infestation is occurring proximate the structure. Also, eachof the devices will be mapped relative to one another, and relative tothe structure. A comparison of the amount of termite-inflicted damageoccurring at the respective devices 10 can then enable a person todetermine an approximate localized region of any occurring termiteinfestation. It can be advantageous to pinpoint a localized region ofinfestation as such can limit an amount of pesticide utilized fordestroying the termites.

Difficulties can occur in monitoring the amount of termite-inflicteddamage occurring at each of the many devices 10 provided around astructure. For instance, it can be difficult to regularly and accuratelydocument the amount of damage at each of the devices. As an example, itcan be difficult to remember exactly which of the various devicescorrelates to a specific location on a map of the devices. As anotherexample, it can be difficult to accurately record a reading oftermite-inflicted damage associated with an individual device. As yetanother example, it can be tedious and time-consuming to open all of thereceptacles 14 proximate the given structure and manually check theblocks 20 and 22 within the receptacles for termite-inflicted damage.

One method of reducing the above-discussed difficulties is to providebar codes on the lids 18 of receptacles 14. Such bar codes can bescanned to specifically identify a particular device which can simplifycorrelating the devices to locations on a map of the devices. However,ascertaining an amount of termite-inflicted damage can still betime-consuming in that the receptacles still have to be opened and theblocks of wood manually checked to determine if termite-inflicted damagehas occurred to the wood.

A recently proposed improvement for monitoring an amount oftermite-inflicted damage in a device similar to device 10 is describedwith reference to FIGS. 3 and 4. Referring to FIG. 3, a device 100comprises a receptacle 14 of the type described above with reference toFIG. 1, and comprises a cap 18 configured to be received over an opentype of receptacle 14. Device 100 further comprises the pair of woodenblocks 20 and 22, and a holder 110 similar to the holder 24 describedabove with reference to FIG. 1. Holder 110 can comprise, for example,plastic, and differs from holder 24 in that it comprises both a topshelf 112 and a bottom shelf 114, whereas holder 24 only comprised abottom shelf. In the shown embodiment, shelf 112 is configured with aslit 116 so that shelf 112 can be slid over a prior holding device (suchas the device 24 of FIG. 1) to form the holding device 110. Slit 116 isoptional, and shelf 112 can be molded in one piece with the othercomponents of holder 110. Holder 110 can be considered as comprising apillar 111 extending between shelves 112 and 114, and an extension 113protruding above shelf 112. Extension 113 is configured to enable aperson to lift holder 110 by the extension, and in the shown embodimentcomprises an eye 115 extending therethrough. Shelf 112 can comprise anelectrically insulative material, such as, for example, plastic (forinstance, polypropylene).

Device 100 further comprises an electronic termite sensing loop 118 ofconductive material. Loop 118 is formed on a substantially planarsubstrate 120, and is preferably formed of material which can be removedby termites. Exemplary materials are printable materials comprisingconductive particles, such as, for example, metal particles or carbonparticles. Suitable materials are, for example, silver-filled printedthick film ink and silver-filled epoxy. An exemplary silver-filled inkis Dupont Electronics 5028™ (available from Dupont Electronics ofWilmington, Del.), which is a silver polymer conductor. Another suitablematerial for loop 118 is a carbon-particle-containing ink (typically theparticles will consist essentially of carbon), such as, for example, amaterial marked by Dupont Electronics as 7102™ Carbon Polymer Conductor(available from Dupont Electronics of Wilmington, Delaware).Carbon-particle-containing inks can be cheaper than other inks, betteraccepted by pests (i.e., apparently more palatable to the pests), andless subject to environmental damage. Further, the inclusion of carboninks in a circuit can lower an electrical conductivity (i.e., raise aresistivity) of the circuit. The lowered conductivity can increase thereliability of data obtained from the circuit. More specifically, theinclusion of carbon-particle-containing inks in loop 118 can render thecircuit of loop 118 less susceptible to registering false negativereadings if mud or water bridges an opening in the circuit.

Substrate 120 is preferably formed of material which can be removed bytermites. Exemplary materials are polyethylene foam and polyester. Theconductive material of loop 118 can be directly applied to substrate 120using, for example, screen printing methods. Substrate 120 can bepretreated prior to applying the conductive material of loop 118 oversubstrate 120. Such pretreatment can comprise, for example, flamepretreatment to promote adhesion of the conductive material to the foam.

An electrically insulative protective material 127 (only some of whichis shown in FIG. 3) is provided over loop 118 and substrate 120.Protective material 127 can protect conductive loop 118 from water,abrasion or other environmental damage. the insulative protectivematerial can comprise, for example, a resin which is provided as aliquid and cured by exposure to one or more of heat, ultraviolet lightand oxygen. A suitable insulative protective material is a materialselected from the general class of epoxy resins (such as, for example, atwo-part epoxy resin). Another suitable insulative protective materialis a material selected for the general class of thick film inks.Exemplary insulative protective materials are Dupont 5015™ and 5018™(available from Dupont Electronics of Wilmington, Del.), with 5018™being an ultraviolet light curable dielectric material. Anotherexemplary insulative protective material is a tape adhered over loop 118with an adhesive.

A termite attractant (such as, for example, a suitable pheromone) can beprovided in addition to the insulative protective material. Suchattractant can, for example, be formed over the insulative protectivematerial or blended within the insulative protective material.

In the shown configuration, substrate 120 comprises a pair of opposingsidewall edges 121 and 123, and a plurality of notches 122 extendinginto sidewall edges 121 and 123. Notches 122 are provided to formcrevices within which the termites can burrow.

Conductive loop 118 comprises a pair of ends (130 and 132), with end 132connected to a first prong 134 and end 130 connected to a second prong136. Device 100 further comprises a circuit board 150 having circuitry(not shown in FIG. 3) supported thereby and a pair of orifices (152 and154) extending therethrough. Board 150 can be considered as a circuitsupport. Shelf 112 has a pair of orifices 156 and 158 extendingtherethrough, and configured to be aligned with orifices 152 and 154 ofcircuit board 150. In operation, device 100 is assembled by providingsubstrate 120 within holder 114 such that prongs 134 and 136 extendthrough orifices 156, 158, 152 and 154 to retain circuit board 150 atopshelf 112. Circuit board 150 can then be adhered to shelf 112 and/orprongs 134 and 136. Blocks 20 and 22 are subsequently provided withinholder 110 to form an assembly 160 which can be removably insertedwithin receptacle 14.

The circuitry supported by circuit board 150 can comprise at least aportion of a transponder unit and is configured to be incorporated intoa passive radio frequency identification device (RFID) system. Thetransponder unit can comprise, for example, a parallel resonant LCcircuit, with such circuit being resonant at a carrier frequency of aninterrogator. The transponder unit is in electrical connection with anantenna 155 provided externally of the circuitry supported by board 150.Exemplary circuit board/transponder unit assemblies are described inU.S. patent application Ser. No. 08/705,043, filed Aug. 29, 1996, whichis assigned to the assignee of the present invention and herebyincorporated by reference.

Referring to FIG. 4, an RFID system 60 comprises the transpondersupported by a structure 150 (which can comprise, for example, a circuitboard) and an interrogator 45 configured to be passed over suchtransponder unit. Interrogator 45 comprises a coil antenna configured tostimulate the transponder unit. Such coil antenna consists of one ormore coils of conductive material provided within a single plane, andcan be in the form of, for example, a loop antenna.

In operation, interrogator 45 provides a carrier signal which powers(stimulates) the transponder unit supported by board 150 and causes asignal to be transmitted from the transponder unit. The signal comprisesdata which identifies the transponder unit. Such signal can alsoidentify if the conductive loop 118 is broken. The signal is received byinterrogator 45, and eventually provided to a processing systemconfigured to decode and interpret the data. Such processing system canbe provided in a portable unit with interrogator 45, or can be providedin a separate unit to which data from interrogator 45 is subsequentlydownloaded.

By having a signal from the transponder unit change with a break incircuit 118, device 100 can indicate if damage has occurred to loop 118through a signal sent to an interrogator. Such can enable personsutilizing the device to ascertain if termites are present without havingto remove blocks 20 and 22 from receptacle 14, and even without havingto remove the lid 18 from receptacle 14. Once damage to circuit 118 isdetected with an interrogator, persons can remove assembly 160 andquantitate an amount of damage occurring within blocks 20 and 22 todetermine an extent of termite infestation.

The device 160 is suitable for many applications in which it is desiredto detect termite infestation. However, the device can be difficult toassemble and utilize in particular applications. Accordingly, it wouldbe desirable to develop alternative devices for detecting termiteinfestation.

SUMMARY OF THE INVENTION

In one aspect, the invention encompasses an electrical apparatus. Suchapparatus comprises a first substrate having first circuitry thereon.The first circuitry has a terminal extending therefrom, and the terminaldefines a first electrical node. The apparatus further comprises a firstdielectric material covering a predominate portion of the firstcircuitry and not covering the first electrical node. Additionally, theapparatus comprises a second substrate having second circuitry thereon.The second circuitry has a terminal extending therefrom, and suchterminal defines a second electrical node. A second dielectric materialcovers a predominate portion of the second circuitry, but does not coverthe second electrical node. The second substrate comprises a differentmaterial than the first substrate. A portion of the second substrate isover a portion of the first substrate to define an overlap between thefirst and second substrates. The second electrical node overlaps thefirst electrical node in the overlap between the first and secondsubstrates. A conductive material is within the overlap between thefirst and second substrates and electrically bonds the first and secondelectrical nodes to one another.

In another aspect, the invention encompasses a termite sensingapparatus. Such apparatus comprises a first substrate having aconductive loop thereon. The loop has a pair of terminals extendingtherefrom, with the terminals defining first and second electricalnodes. A first dielectric material covers a predominate portion of theconductive loop and defines a fluid-type protective layer over suchpredominate portion of the conductive loop. The first dielectricmaterial does not cover the first and second electrical nodes. Thetermite sensing apparatus further comprises a second substrate having apair of conductive lines thereon. The conductive lines are a first lineand a second line, and are spaced from one another. The first conductiveline has a pair of opposing ends, and the second conductive line has apair of opposing ends. One of the opposing ends of the first conductiveline defines a third electrical node, and the other of the opposing endsof the first conductive line defines a fourth electrical node. One ofthe opposing ends of the second conductive line defines a fifthelectrical node, and the other of the opposing ends of the secondconductive line defines a sixth electrical node. The third and fifthelectrical nodes are proximate one another. A portion of the secondsubstrate is over a portion of the first substrate to define an overlapbetween the first and second substrates. The third electrical nodeoverlaps the first electrical node in the overlap between the first andsecond substrates, and the fifth electrical node overlaps the secondelectrical node in such overlap between the first and second substrates.A conductive material is within the overlap between the first and secondsubstrates. Such conductive material electrically bonds the first andthird electrical nodes to one another, and electrically bonds the secondand fifth electrical nodes to one another.

In yet other aspects, the invention encompasses methods of formingelectrical apparatuses.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

FIG. 1 is a diagrammatic, cross-sectional view of an assembled prior arttermite sensing device embedded in the ground.

FIG. 2 is a perspective view of the prior art termite sensing device ofFIG. 1 in a disassembled configuration.

FIG. 3 is a disassembled view of a prior art electronic sensorconfigured to detect termite infestation.

FIG. 4 is a diagrammatic view of a person extracting information fromthe prior art electronic termite sensing device of FIG. 3.

FIG. 5 is a diagrammatic view of a portion of a termite sensing deviceencompassed by the present invention at an initial step of a method ofthe present invention.

FIG. 6 is a view of the FIG. 5 portion shown at a processing stepsubsequent to that of FIG. 5.

FIG. 7 is a diagrammatic view of a second portion of a termite sensingdevice of the present invention, and shown at an initial processingstep.

FIG. 8 is a view of the FIG. 7 portion shown at a processing stepsubsequent to that of FIG. 7.

FIG. 9 is a diagrammatic view of an assembly comprising the firstportion of FIG. 6, and the second portion of FIG. 8.

FIG. 10 is a partially disassembled, diagrammatic view of a thirdportion of a termite sensing device encompassed by the presentinvention.

FIG. 11 is a partially disassembled, diagrammatic view of a devicecomprising the assembly of FIG. 9, joined with the third portion of FIG.10.

FIG. 12 is a diagrammatic side view of a termite sensing deviceencompassed by the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of theconstitutional purposes of the U.S. Patent Laws “to promote the progressof science and useful arts” (Article 1, Section 8).

A difficulty which can occur in forming the prior art termite sensingdevice of FIG. 3 is in connecting circuit support 150 with prongs 134and 136. It is desired to have the circuitry associated with support 150be planar along a surface of the ground so that it can be readilystimulated by an interrogator passed along the ground surface and oversuch circuitry, and it is further desirable to have the circuitry ofloop 118 extending perpendicular with the surface of the ground so thatsuch circuitry is likely to be intercepted by termites passing atvarious depths beneath a ground surface. An apparent solution forconnecting loop 118 to circuitry associated with board 150, withouthaving to utilize prongs 134 and 136, is simply to bend support 120 sothat part of loop 118 will extend perpendicular to a ground surface, andanother part (specifically, the ends of the loop) will extendsubstantially parallel with the surface of the ground. However, suchwill require a 90° bend in foam substrate 120, which would likely breakthe substrate and accordingly break the circuit of loop 118. The presentinvention provides a mechanism by which circuitry can be bent to enablea connection from the conductive loop extending perpendicular to aground surface to a transponder circuit extending parallel with theground surface.

An assembly encompassed by the present invention is shown in FIG. 12,and a method of forming such assembly is described with reference toFIGS. 5-12. In referring to FIGS. 5-12, similar numbering will beutilized as was used in describing the prior art, with the suffix “a”used to differentiate structures of FIGS. 5-12 from the correspondingstructures of the prior art FIGS. 1-4.

Referring to FIG. 5, a first portion 190 of a termite sensing device ofthe present invention is shown. Portion 190 comprises a first substrate120 a. Substrate 120 a is similar to substrate 120 of the prior art(FIG. 3), and preferably comprises a material which can be removed bytermites, and can comprise, for example, polyethylene foam. Substrate120 a comprises notches 122 a formed therein, and such notches canprovide crevices within which termites can burrow.

Substrate 120 a has an upper surface 119 a, and a conductive materialloop 118 a is formed on such surface. Loop 118 a can be formed utilizingmethodology described above for forming loop 118 (FIG. 3), such as, forexample, by screen printing one or both of a carbon-particle-containingink and a metal-containing ink onto substrate 120. Loop 118 a has a pairof ends (or terminals) 130 a and 132 a extending therefrom. Terminals130 a and 132 a define first and second electrical nodes, respectively.Terminals 130 a and 132 a comprise a thickened region of the conductivematerial relative to the rest of loop 118 a. Such thickened region ofconductive material can simplify connection of terminals 130 a and 132 ato other circuitry (described below). Substrate 120 a has a pair ofopposing ends 141 a and 143 a. Terminals 130 a and 132 a are proximateend 143 a of substrate 120 a, but are spaced from such end by gaps 200.Such spacing can enable terminals 130 a and 132 a to be completelyprotected from the environment by simply providing a protective coveringover surface 119 a and loop 118 a. In contrast, if terminals 130 a and132 a extended all the way to end 143 a, the terminals would have asurface exposed over end 143 a, and such surface could be difficult toprotect from the environment. It is to be understood, however, that theshown embodiment is an exemplary embodiment, and that the inventionencompasses other embodiments (not shown) having other configurations.Such other embodiments include, for example, embodiments in whichterminals 130 a and 132 a extend to, and even beyond, end 143 a.

Referring to FIG. 6, a dielectric material 202 is provided over apredominate portion of conductive loop 118a (shown in phantom view inFIG. 6). Specifically, dielectric material 202 covers an entirety ofloop 118 a except for the ends of terminals 130 a and 132 a. Theuncovered ends 130 a and 132 a define first and second electrical nodes,respectively. Dielectric material 202 can comprise, for example,materials described above for prior art layer 127 (FIG. 3), and can forma fluid-tight protective layer over conductive loop 118 a. Dielectricmaterial 202 can have a termite attractant (such as, for example, atermite-attracting pheromone) mixed therein.

Referring to FIG. 7, a second portion. 210 of a termite sensing deviceof the present invention is shown. Portion 210 comprises a secondsubstrate 212 having an upper surface 215, and pair of conductive lines214 and 216 formed on surface 215. Substrate 212 preferably comprises aflexible material, such as, for example, polyester or other plastics.Conductive lines 214 and 216 can comprise the same material utilized forconductive loop 118 a, and can be printed onto substrate 212 by, forexample, screen printing. In embodiments in which substrate 212comprises an insulative material, conductive lines 214 and 216 can beprinted directly onto the material. In other embodiments (not. shown)substrate 212 can comprise a conductive material, and a dielectricmaterial can be provided over such conductive material prior to theforming of conductive lines 214 and 216 over the substrate. Conductivelines 214 and 216 together comprise a circuit pattern formed oversubstrate 212. Conductive line 214 can be referred to as a firstconductive line, and conductive line 216 can be referred to as a secondconductive line.

First conductive line 214 comprises a pair of ends (218 and 220), andsecond conductive line 216 comprises another pair of ends (222 and 224).End 222 of second conductive line 216 is proximate end 218 of firstconductive line 214, and end 224 of second conductive line 216 isproximate end 220 of first conductive line 214. Ends 218, 220, 222 and224 define electrical nodes. Electrical nodes 222 and 224 are referredto herein as a third electrical node and fourth electrical node,respectively, and electrical nodes 218 and 220 are referred to herein asa fifth and sixth electrical node, respectively.

Substrate 212 comprises a pair of opposing ends 230 and 232. Conductivelines 214 and 216 are spaced from end 230 by gaps 234 and 236,respectively, and are spaced from end 232 by gaps 238 and 240,respectively.

A dielectric material 242 is formed over a predominate portion ofcircuitry 218. Dielectric material 242 can comprise the same materialsdescribed above with reference to dielectric material 127 of the priorart (FIG. 3). Dielectric material 242 does not cover the ends ofconductive lines 214 and 216, and accordingly leaves the third, fourth,fifth and sixth electrical nodes exposed. Dielectric material 242 canform a fluid-tight protective coating over the predominate portion of218 covered by such dielectric material.

Referring to FIG. 8, a conductive material 250 is provided over ends218, 220, 222 and 224. Conductive material 250 can comprise, forexample, an adhesive having conductive particles dispersed therein. Asuitable adhesive is 3M #9703™ electrically conductive adhesive transfertape (Z-axis tape), available from 3M Corporation of St. Paul, Min. Thematerial is referred to as a Z-axis adhesive because such materialconducts electricity only in a Z-axis direction. Accordingly, thematerial will not form a short between conductive lines 214 and 216, butcan form electrical connections from conductive lines 214 and 216 toother circuitry formed thereover. In the preferred embodiment, theconductive adhesive overlaps the edges of dielectric material 242, andextends from the edges to ends 230 and 232 of substrate 212. The Z-axisadhesive 250 and dielectric material 242 thus can together comprise afluid-tight seal which extends entirely over conductive lines 214 and216, as well as entirely over the surface 215 of substrate 212 (FIG. 7).

In embodiments in which the conductive adhesive 250 comprises a Z-axistape, the adhesive will be provided with a release liner adheredthereto. Such release liner can be left in place in forming theconstruction shown in FIG. 8.

Referring to FIG. 9, the assembly 210 of FIG. 8 is adhered to theassembly 190 of FIG. 6 utilizing the adhesive 250 proximate end 230. (Inembodiments in which conductive adhesive 250 comprises a Z-axis tape,the release liner over Z-axis tape 250 proximate end 230 will be removedprior to forming the construction of FIG. 9.) The assembly 210 isinverted relative to assembly 190 in the FIG. 9 construction such thatso-called upper surface 215 (FIG. 7) of substrate 212 faces downwardlytoward upper surface 119 a of substrate 120 a. Such enables electricalconnection of nodes 218 and 222 with nodes 132 a and 130 a,respectively.

Substrate 212 overlaps with substrate 120 a in an overlap region 260.Also, third electrical node 222 overlaps with first electrical node 130a in overlap region 260, and fifth electrical node 218 overlaps withsecond electrical node 132 a in such overlap region. Conductive material250 bonds third electrical node 222 to first electrical node 130 a, andfifth electrical node 218 to second electrical node 132 a. Inembodiments in which material 250 comprises a Z-axis adhesive, suchmaterial can form a conductive bond between the first and third nodes,as well as between the second and fifth nodes, without causing a shortbetween conductive lines 214 and 216.

In the shown embodiment, dielectric material 202 and dielectric material242 both extend into the overlap region 260. Such can assist in forminga water-tight seal within overlap region 260. A water-tight seal isdesired to prevent water from leaking between lines 214 and 216, andcausing an electrical short between such lines.

Referring to FIG. 10, a transponder assembly 270 is shown in a partiallydisassembled view. Transponder assembly 270 comprises a circuitsupporting substrate 150 a, and circuitry 272 (shown in phantom due toits being beneath a layer 280) formed over substrate 150 a. Circuitry272 is preferably configured to define at least a portion of atransponder device. An antenna 155 a connects to circuitry 272 andextends over substrate 150 a.

Circuitry 272 is connected with a pair of terminals 274 and 276 (shownin phantom due to their being beneath layers 280 and 300). A substrate278 is joined to board 150 a, and supports terminals 274 and 276.Substrate 278 is preferably a flexible material, such as, for example,polyethylene or other forms of plastic. Terminals 274 and 276 cancomprise a printed conductive material, and can comprise, for example,the materials discussed above for forming conductive loop 118 a.Alternatively, terminals 274 and 276 can comprise, for example, metalwires.

A dielectric material 280 is shown formed over substrates 150 a and 278.Dielectric material 280 encapsulates circuitry 272 and predominateportions of conductive lines 274 and 276. Dielectric material 280 cancomprise, for example, the materials described above for utilization indielectric material 202.

Terminals 274 and 276 comprise ends 290 and 292, respectively. Ends 290and 292 define seventh and eighth electrical nodes, respectively.Dielectric material 280 does not cover such electrical nodes. Aconductive adhesive 300 is provided over the electrical nodes defined byends 290 and 292, as well as over a portion of substrate 278 proximateends 290 and 292 (i.e., a terminal, or end, portion of substrate 278).Conductive adhesive 300 can comprise, for example, a Z-axis adhesive ofthe type described above for material 250.

Referring to FIG. 11, assembly 270 is combined with assemblies 190 and210 to form a termite sensing device 310. Preferably, the transponderencompassed by circuitry 272 is configured to emit a first signal whenconductive loop 118 a is intact, and a second signal if conductive loop118 a is broken, with the second signal being different than the firstsignal.

It is noted that one or the other of conductive adhesive 300 on assembly270 and conductive adhesive 250 proximate end 232 of assembly 210 isoptional, in that conductive adhesive applied to either of assemblies270 or 210 can be utilized to bind the assemblies 270 and 210 together.It is further noted that substrate 278 and terminals 274 and 276 areoptional, and that circuitry 272 can be directly bonded to ends 220 and224 of lines 214 and 216.

Referring to FIG. 12, sensing device 310 is shown incorporated into atermite detecting device 400. The relative scales of portions 190, 210and 270 are changed in the view of FIG. 12 relative to FIGS. 5-11, withthe relative scales in FIG. 12 being a more preferred application of theinvention, and the relative scales of FIGS. 5-11 being utilized forillustration purposes.

FIG. 12 shows sensing device 310 provided between a pair of woodenblocks 20 a and 22 a, and adjacent a holder 24 a that is also providedbetween the wooden blocks. Substrate 190 is between blocks 20 a and 22a, whereas flexible substrate 210 extends from between blocks 20 a and22 a to over block 20 a. Flexible substrate 210 is bent around a cornerof block 20 a. The overlap of substrate 212 relative to substrates 120 aand 278 can be seen in the view of FIG. 12.

It is noted that antenna 155 is shown overlapping substrate 212, andreceived over both of blocks 20 a and 22 a. Such can be accomplished bysliding the loop antenna over an upper portion of holder 24 a. Antenna155 can be joined to circuitry 272 (FIG. 10) before joining substrate278 with substrate 212, after joining substrate 278 with substrate 212,and/or after providing the rest of assembly 310 between blocks 20 a and22 a.

In preferred embodiments, substrate 212 is formed of a more flexiblematerial than substrate 190. Specifically, substrate 190 is preferablyformed of a relatively firm foam, which can be removed by termites,whereas substrate 212 is preferably formed of a relatively flexibleplastic material, such as, for example, polyethylene. Substrate 212 canthen be bent around within receptacle 14 a without breaking thesubstrate, and accordingly without breaking circuitry formed over thesubstrate.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

What is claimed is:
 1. An electrical apparatus comprising: a firstsubstrate having first circuitry thereon, the first circuitry having aterminal extending therefrom, said terminal of the first circuitrydefining a first electrical node; a second substrate having secondcircuitry thereon, the second circuitry having a terminal extendingtherefrom, said terminal of the second circuitry defining a secondelectrical node, the second substrate comprising a different materialthan the first substrate, a portion of the second substrate being over aportion of the first substrate to define an overlap between the firstand second substrates, the second substrate being more flexible than thefirst substrate; and a conductive material being within the overlapbetween the first and second substrates and electrically bonding thefirst and second electrical nodes to one another.
 2. The apparatus ofclaim 1 wherein the first substrate is foam and the second substrate ispolyester.
 3. The apparatus of claim 1 further comprising thirdcircuitry joined to the second substrate, the third circuitry comprisinga radio frequency identification device transponder and beingelectrically connected to the first circuitry through the secondcircuitry.
 4. The apparatus of claim 1 wherein the first substrate isfoam and the second substrate is polyester, and further comprising thirdcircuitry joined to the second substrate, the third circuitry comprisinga radio frequency identification device transponder and beingelectrically connected to the first circuitry through the secondcircuitry.
 5. An electrical apparatus comprising: a first substratehaving first circuitry thereon, the first circuitry having a terminalextending therefrom, said terminal of the first circuitry defining afirst electrical node; a first dielectric material covering apredominate portion of the first circuitry and not covering the firstelectrical node; a second substrate having second circuitry thereon, thesecond circuitry having a terminal extending therefrom, said terminal ofthe second circuitry defining a second electrical node, the secondsubstrate comprising a different material than the first substrate, aportion of the second substrate being over a portion of the firstsubstrate to define an overlap between the first and second substrates;a second dielectric material covering a predominate portion of thesecond circuitry and not covering the second electrical node, the secondelectrical node overlapping the first electrical node in the overlapbetween the first and second substrates; and a conductive material beingwithin the overlap between the first and second substrates andelectrically bonding the first and second electrical nodes to oneanother.
 6. The apparatus of claim 5 wherein: the first circuitrycomprises a conductive loop; the second circuitry comprises a pair ofspaced conductive lines; the conductive loop comprises a pair of ends,one of the ends being the first terminal and an other of the ends beinga third terminal; one of the pair lines comprises an end that is thesecond terminal; an other of the pair of lines comprises an end that isa fourth terminal; and the third terminal overlaps the fourth terminalin the overlap between the first and second substrates and is bonded tothe fourth terminal by the conductive material.
 7. The apparatus ofclaim 5 wherein the conductive material comprises a conductive adhesive.8. The apparatus of claim 5 wherein the conductive material comprises aZ-axis adhesive.
 9. The apparatus of claim 5 wherein the first andsecond dielectric materials are the same as one another.
 10. Theapparatus of claim 5 wherein the first and second dielectric materialsextend into the overlap between the first and second substrates, andwherein the conductive material overlaps the first and second dielectricmaterials.
 11. The apparatus of claim 5 wherein the first substrate ismore rigid than the second substrate.
 12. The apparatus of claim 11wherein the first substrate comprises foam and the second substratecomprises plastic.
 13. The apparatus of claim 11 wherein the firstsubstrate comprises foam and the second substrate comprises polyester.14. A method of forming an electrical apparatus, comprising: providing afirst substrate having first circuitry thereon; forming a firstdielectric material over a predominant portion of the first circuitry,the first dielectric material not covering a portion of the firstcircuitry; providing a second substrate having second circuitry thereon,the second substrate comprising a different material than the firstsubstrate; forming a second dielectric material over a predominantportion of the second circuitry, the second dielectric material notcovering a portion of the second circuitry; placing the first and secondsubstrates relative to one another with a portion of the secondsubstrate being over a portion of the first substrate to define anoverlap between the first and second substrates, the uncovered portionof the second circuitry overlapping the uncovered portion of the firstcircuitry in the overlap between the first and second substrates; andproviding a conductive material within the overlap between the first andsecond substrates to electrically bond the uncovered portions of thefirst and second circuitries to one another.
 15. The method of claim 14wherein the conductive material comprises a conductive adhesive.
 16. Themethod of claim 14 wherein the conductive material comprises a Z-axisadhesive.
 17. The method of claim 14 wherein the first and seconddielectric materials are the same as one another.
 18. The method ofclaim 14 wherein the first and second dielectric materials extend intothe overlap between the first and second substrates, and wherein theconductive material overlaps the first and second dielectric materials.19. The method of claim 14 wherein the first substrate is more rigidthan the second substrate.
 20. The method of claim 19 wherein the firstsubstrate comprises foam and the second substrate comprises plastic. 21.The method of claim 19 wherein the first substrate comprises foam andthe second substrate comprises polyester.
 22. A method of forming anelectrical apparatus, comprising: providing a first substrate; printingfirst circuitry on the first substrate, the first circuitry having aterminal extending therefrom, said terminal of the first circuitrydefining a first electrical node; forming a first dielectric materialover a predominate portion of the first circuitry, the first dielectricmaterial not covering the first electrical node; providing a secondsubstrate; forming second circuitry on the second substrate, the secondcircuitry having a terminal extending therefrom, said terminal of thesecond circuitry defining a second electrical node, the second substratecomprising a different material than the first substrate; forming asecond dielectric material over a predominate portion of the secondcircuitry, the second dielectric material not being over the secondelectrical node; placing the first and second substrates relative to oneanother with a portion of the second substrate being over a portion ofthe first substrate to define an overlap between the first and secondsubstrates, the second electrical node overlapping the first electricalnode in the overlap between the first and second substrates; andproviding a conductive material within the overlap between the first andsecond substrates to electrically bond the first and second electricalnodes to one another.
 23. The method of claim 22 wherein: the firstcircuitry comprises a conductive loop and is formed by printing aconductive ink on the first substrate; the second circuitry comprises apair of spaced conductive lines and is formed by printing a conductiveink on the second substrate; the conductive loop comprises a pair ofends, one of the ends being the first terminal and an other of the endsbeing a third terminal; one of the pair lines comprises an end that isthe second terminal; an other of the pair of lines comprises an end thatis a fourth terminal; and the third terminal overlaps the fourthterminal in the overlap between the first and second substrates and isbonded to the fourth terminal by the conductive material.
 24. The methodof claim 22 wherein the conductive material comprises a conductiveadhesive.
 25. The method of claim 22 wherein the conductive materialcomprises a Z-axis adhesive.
 26. The method of claim 22 wherein thefirst and second dielectric materials are the same as one another andare printed on the first and second substrates, respectively.
 27. Themethod of claim 22 wherein the first and second dielectric materialsextend into the overlap between the first and second substrates, andwherein the conductive material overlaps the first and second dielectricmaterials.
 28. The method of claim 22 wherein the first substrate ismore rigid than the second substrate.
 29. The method of claim 28 whereinthe first substrate comprises foam and the second substrate comprisesplastic.
 30. The method of claim 28 wherein the first substratecomprises foam and the second substrate comprises polyester.